[Horizon House Publications 33rd European Microwave -...

[Horizon House Publications 33rd European Microwave - Munich, Germany (7-9 Oct. 2003)] 33rd European Microwave Conference Proceedings (IEEE Cat. No.03EX723C) - Characterisation, modelling and design of bond-wire interconnects for chip-package co-design

Chandrasekhar, A., Stoukatch, S., Brebels, S., Balachandran, J., Beyne, E., De Raedt, W., Nauwelaers, B., Poddar, A.

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Year:

2003

Language:

english

DOI:

10.1109/EUMC.2003.1262279

File:

PDF, 246 KB

english, 2003

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