Towards large size substrates for III-V co-integration made...

APL Materials 2014 / 08 Vol. 2; Iss. 8

Towards large size substrates for III-V co-integration made by direct wafer bonding on Si

Daix, N., Uccelli, E., Czornomaz, L., Caimi, D., Rossel, C., Sousa, M., Siegwart, H., Marchiori, C., Hartmann, J. M., Shiu, K.-T., Cheng, C.-W., Krishnan, M., Lofaro, M., Kobayashi, M., Sadana, D., Fo
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Volume:
2
Language:
english
Journal:
APL Materials
DOI:
10.1063/1.4893653
Date:
August, 2014
File:
PDF, 955 KB
english, 2014
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