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[IEEE 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Shanghai, China (2005.6.27-2005.6.27)] 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Packaging Issues on Combination of LED and Flip Chip
Zhao, Kun, Ma, Shiwei, Su, Shihu, Zhang, JianhuaYear:
2006
Language:
english
DOI:
10.1109/hdp.2005.251416
File:
PDF, 137 KB
english, 2006