[IEEE 2005 Conference on High Density Microsystem Design...

  • Main
  • [IEEE 2005 Conference on High Density...

[IEEE 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Shanghai, China (2005.6.27-2005.6.27)] 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Packaging Issues on Combination of LED and Flip Chip

Zhao, Kun, Ma, Shiwei, Su, Shihu, Zhang, Jianhua
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2006
Language:
english
DOI:
10.1109/hdp.2005.251416
File:
PDF, 137 KB
english, 2006
Conversion to is in progress
Conversion to is failed