![](/img/cover-not-exists.png)
Thermal expansion of Ni/Cu multilayers
Su, C. M., Kim, T., Oberle, R. R., Cammarata, R. C., Wuttig, ManfredVolume:
76
Year:
1994
Language:
english
Journal:
Journal of Applied Physics
DOI:
10.1063/1.357289
File:
PDF, 655 KB
english, 1994