[IEEE 2006 7th International Conference on Electronic Packaging Technology - Shanghai, China (2006.08.26-2006.08.29)] 2006 7th International Conference on Electronic Packaging Technology - Effect of Interfacial IMCs Proportion on the Reliability of Miniature Lead-Free Solder Joint
Wu, Fengshun, He, Mingmin, Wu, Yiping, An, Bing, Zhang, WeigangYear:
2006
Language:
english
DOI:
10.1109/icept.2006.359754
File:
PDF, 4.58 MB
english, 2006