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[IEEE 2012 13th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cascais, Portugal (2012.04.16-2012.04.18)] 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Experimental system for analysing the combined loading and failure modes of solder joints in electronic packaging
Jankowski, Krystian, Wymyslowski, Artur, Chicot, DidierYear:
2012
Language:
english
DOI:
10.1109/esime.2012.6191743
File:
PDF, 2.24 MB
english, 2012