[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Microstructure analysis of sputtered copper thin film in packaging substrate
Lyu, Ping, Yu, Hongkun, Wang, TechunYear:
2013
Language:
english
DOI:
10.1109/icept.2013.6756553
File:
PDF, 1.79 MB
english, 2013