The effect of density and microstructure on the performance of TiN barrier films in Cu metallization
Park, Ki-Chul, Kim, Ki-Bum, Raaijmakers, Ivo J. M. M., Ngan, KenVolume:
80
Year:
1996
Language:
english
Journal:
Journal of Applied Physics
DOI:
10.1063/1.363620
File:
PDF, 1.12 MB
english, 1996