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High-Strength Pressure-Free Bonding Using Cu and Ni-Sn Nanoparticles
Watanabe, Ryota, Ishizaki, ToshitakaVolume:
31
Language:
english
Journal:
Particle & Particle Systems Characterization
DOI:
10.1002/ppsc.201300273
Date:
June, 2014
File:
PDF, 12.91 MB
english, 2014