High-Strength Pressure-Free Bonding Using Cu and Ni-Sn...

High-Strength Pressure-Free Bonding Using Cu and Ni-Sn Nanoparticles

Watanabe, Ryota, Ishizaki, Toshitaka
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
31
Language:
english
Journal:
Particle & Particle Systems Characterization
DOI:
10.1002/ppsc.201300273
Date:
June, 2014
File:
PDF, 12.91 MB
english, 2014
Conversion to is in progress
Conversion to is failed