[Japan Soc. Applied Phys 2003 Symposium on VLSI Technology....

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[Japan Soc. Applied Phys 2003 Symposium...

[Japan Soc. Applied Phys 2003 Symposium on VLSI Technology. Digest of Technical Papers - Kyoto, Japan (10-12 June 2003)] 2003 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.03CH37407) - Impacts of high modulus ultra low-k/Cu 300 mm-wafer integration for 65 nm technology node and beyond

Sone, S., Ohashi, N., Shin, H.J., Misawa, K., Kaji, N., Inukai, K., Matsushita, A., Sudou, K., Tokitoh, S., Kondo, S., Yoon, B.U., Yoneda, K., Yoshie, T., Ohtsuka, N., Okamura, H., Toyoda, Y., Shoji,

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Year:

2003

Language:

english

DOI:

10.1109/vlsit.2003.1221117

File:

PDF, 165 KB

english, 2003

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