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[IEEE 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Austin, TX, USA (2010.10.25-2010.10.27)] 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems - Multi-physics modeling of through-silicon vias with equivalent-circuit approach
Liu, En-Xiao, Li, Er-Ping, Ewe, Wei-Bin, Lee, Hui MinYear:
2010
Language:
english
DOI:
10.1109/epeps.2010.5642537
File:
PDF, 724 KB
english, 2010