Reliability of Lead-Free Solder Interconnections in Thermal...

IEEE Transactions on Components and Packaging Technologies 2009 / 06 Vol. 32; Iss. 2

Reliability of Lead-Free Solder Interconnections in Thermal and Power Cycling Tests

Jue Li,, Karppinen, J., Laurila, T., Kivilahti, J.K.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
32
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2009.2012518
Date:
June, 2009
File:
PDF, 1.27 MB
english, 2009
Conversion to is in progress
Conversion to is failed