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Reliability of Lead-Free Solder Interconnections in Thermal and Power Cycling Tests
Jue Li,, Karppinen, J., Laurila, T., Kivilahti, J.K.Volume:
32
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2009.2012518
Date:
June, 2009
File:
PDF, 1.27 MB
english, 2009