[IEEE 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2012.10.24-2012.10.26)] 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - The applications of wafer vacuum laminator equipment in 3D-IC process technology
Sheng-Yu Lin,, Ming-Tzung Chen,, Jeng-Ping Yang,, Pei-Wei Wang,Year:
2012
Language:
english
DOI:
10.1109/impact.2012.6420250
File:
PDF, 1.54 MB
english, 2012