A model for electromigration-induced degradation mechanisms...

Journal of Applied Physics 2007 Vol. 102; Iss. 5

A model for electromigration-induced degradation mechanisms in dual-inlaid copper interconnects: Effect of microstructure

Sukharev, Valeriy, Zschech, Ehrenfried, Nix, William D.
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Volume:
102
Year:
2007
Language:
english
Journal:
Journal of Applied Physics
DOI:
10.1063/1.2775538
File:
PDF, 1.64 MB
english, 2007
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