Analysis on cracking in hard thin films on a soft substrate...

Vacuum 2015 / 02 Vol. 112

Analysis on cracking in hard thin films on a soft substrate under Berkovich indentation

Fu, Kunkun, Chang, Li, Zheng, Bailin, Tang, Youhong, Yin, Yongbai
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Volume:
112
Language:
english
Journal:
Vacuum
DOI:
10.1016/j.vacuum.2014.11.013
Date:
February, 2015
File:
PDF, 1.05 MB
english, 2015
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