In-Situ strain analysis with high spatial resolution: A new...

Engineering Failure Analysis 1996 Vol. 3; Iss. 2

In-Situ strain analysis with high spatial resolution: A new failure inspection tool for integrated circuit applications

T. Nshanian, R. Dove, Krishna Rajan
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Volume:
3
Year:
1996
Language:
english
Pages:
5
DOI:
10.1016/1350-6307(96)00001-5
File:
PDF, 263 KB
english, 1996
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