[IEEE 2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems (MEMS) - Sorrento, Italy (2009.01.25-2009.01.29)] 2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems - An Integrated Solution for Wafer-Level Packaging and Electrostatic Actuation of Out-of-Plane Devices

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