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[IEEE 2008 IEEE International Symposium on Electromagnetic Compatibility - EMC 2008 - Detroit, MI (2008.08.18-2008.08.22)] 2008 IEEE International Symposium on Electromagnetic Compatibility - Analysis of electrode speed correlation of discharge parameters applying short-gap electrostatic discharge model
Ruan, Fangming, Dan Shi,, Yougang Gao,Year:
2008
Language:
english
DOI:
10.1109/isemc.2008.4652040
File:
PDF, 335 KB
english, 2008