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The Effects of Concurrent Power and Vibration Loads on the Reliability of Board-Level Interconnections in Power Electronic Assemblies
Karppinen, J. S., Li, J., Paulasto-Krockel, M.Volume:
13
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2012.2226462
Date:
March, 2013
File:
PDF, 1.92 MB
english, 2013