Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
2011 Vol. 29; Iss. 4
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Analysis of a dip-solder process for self-assembly
Rao, M., Lusth, J. C., Burkett, S. L.Volume:
29
Year:
2011
Language:
english
Journal:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
DOI:
10.1116/1.3610977
File:
PDF, 1.32 MB
english, 2011