In situ observation of electromigration-induced void...

Applied Physics Letters 2004 Vol. 85; Iss. 13

In situ observation of electromigration-induced void migration in dual-damascene Cu interconnect structures

Vairagar, A. V., Mhaisalkar, S. G., Krishnamoorthy, Ahila, Tu, K. N., Gusak, A. M., Meyer, Moritz Andreas, Zschech, Ehrenfried
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Volume:
85
Year:
2004
Language:
english
Journal:
Applied Physics Letters
DOI:
10.1063/1.1795978
File:
PDF, 544 KB
english, 2004
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