[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Filling TSV of different dimension using galvanic copper deposition
Rohde, Dirk, Jager, Cornelia, Hazin, Khatera, Uhlig, AlbrechtYear:
2011
Language:
english
DOI:
10.1109/impact.2011.6117182
File:
PDF, 1.29 MB
english, 2011