![](/img/cover-not-exists.png)
Effects of Fe2NiO4 nanoparticles addition into lead free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process
Chellvarajoo, Srivalli, Abdullah, M.Z., Samsudin, Z.Volume:
67
Language:
english
Journal:
Materials & Design
DOI:
10.1016/j.matdes.2014.11.025
Date:
February, 2015
File:
PDF, 2.41 MB
english, 2015