Electromigration-induced failure and reliability of...

Electromigration-induced failure and reliability of metallizations in integrated circuits

Itskovich, I. F., Sorbello, R. S.
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Volume:
74
Year:
1993
Language:
english
Journal:
Journal of Applied Physics
DOI:
10.1063/1.354841
File:
PDF, 947 KB
english, 1993
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