Effects of Cu stoichiometry on the microstructures,...

Acta Materialia 2006 Vol. 54; Iss. 10

Effects of Cu stoichiometry on the microstructures, barrier-layer structures, electrical conduction, dielectric responses, and stability of CaCu3Ti4O12

Tsang-Tse Fang, Li-Then Mei, Hei-Fong Ho
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Volume:
54
Year:
2006
Language:
english
Pages:
9
DOI:
10.1016/j.actamat.2006.02.037
File:
PDF, 634 KB
english, 2006
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