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[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - The reliability evaluation of Cu wire Bonding by using focus ion beam system
Zhang XiaoWen,, Lin XiaoLing,, Chen Yuan,Year:
2010
Language:
english
DOI:
10.1109/icept.2010.5582717
File:
PDF, 809 KB
english, 2010