Measurement of deformations in SnAgCu solder interconnects...

Measurement of deformations in SnAgCu solder interconnects under in situ thermal loading

Seungbae Park, Ramji Dhakal, Lawrence Lehman, Eric Cotts
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Volume:
55
Year:
2007
Language:
english
Pages:
8
DOI:
10.1016/j.actamat.2007.01.028
File:
PDF, 4.81 MB
english, 2007
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