Measurement of deformations in SnAgCu solder interconnects under in situ thermal loading
Seungbae Park, Ramji Dhakal, Lawrence Lehman, Eric CottsVolume:
55
Year:
2007
Language:
english
Pages:
8
DOI:
10.1016/j.actamat.2007.01.028
File:
PDF, 4.81 MB
english, 2007