[IEEE 2005 International Symposium on Electronics Materials and Packaging - Tokyo, Japan (11-14 Dec. 2005)] 2005 International Symposium on Electronics Materials and Packaging - Effects of the Functional Groups of Non-Conductive Films (NCFs) on Materials Properties and Reliability of NCF Flip-Chip-On-Organic Boards
Chang-Kyu Chung,, Woon-Seong Kwon,, Jin-Hyoung Park,, Soon-Bok Lee,, Kyung-Wook Paik,Year:
2005
Language:
english
DOI:
10.1109/emap.2005.1598253
File:
PDF, 2.80 MB
english, 2005