[IEEE Proceedings of the IEEE 2001 International Interconnect Technology Conference - Burlingame, CA, USA (2001.06.6-2001.06.6)] Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461) - Electroless and electrolytic seed repair effects on Damascene feature fill
Andryuschenko, T., Reid, J.Year:
2001
Language:
english
DOI:
10.1109/iitc.2001.930008
File:
PDF, 378 KB
english, 2001