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[IEEE 2014 International Conference on Electronics Packaging (ICEP) - Toyama, Japan (2014.4.23-2014.4.25)] 2014 International Conference on Electronics Packaging (ICEP) - Relationship between shrinkage and conductivity properties of cured isotropic conductive adhesives
Kohinata, Shigeru, Shiraki, Yoshihiko, Inoue, Masahiro, Uenishi, KeisukeYear:
2014
Language:
english
DOI:
10.1109/icep.2014.6826703
File:
PDF, 375 KB
english, 2014