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[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Effect of cooling rate on Ag3Sn formation in Sn-Ag based lead-free solder
Lee, Hwa-Teng, Chen, Yin-Fa, Hong, Ting-Fu, Shih, Ku-TaYear:
2009
Language:
english
DOI:
10.1109/eptc.2009.5416420
File:
PDF, 1.18 MB
english, 2009