Thermomechanical strain measurements by synchrotron x-ray diffraction and data interpretation for through-silicon vias
Liu, X., Thadesar, P. A., Taylor, C. L., Kunz, M., Tamura, N., Bakir, M. S., Sitaraman, S. K.Volume:
103
Year:
2013
Language:
english
Journal:
Applied Physics Letters
DOI:
10.1063/1.4813742
File:
PDF, 4.41 MB
english, 2013