[IEEE 32nd European Microwave Conference, 2002 - Milan, Italy (2002.10.4-2002.10.6)] 32nd European Microwave Conference, 2002 - Novel Active Integrated Antenna Configuration using Multi-Layered Teflon Substrate and Solder Bump Interconnection for Large Scale Array
Seki, Tomohiro, Cho, Keizo, Mizuno, HidekiYear:
2002
Language:
english
DOI:
10.1109/euma.2002.339357
File:
PDF, 4.23 MB
english, 2002