In situ investigation of unidirectional solidification in Sn–0.7Cu and Sn–0.7Cu–0.06Ni
C.M. Gourlay, K. Nogita, A.K. Dahle, Y. Yamamoto, K. Uesugi, T. Nagira, M. Yoshiya, H. YasudaVolume:
59
Year:
2011
Language:
english
Pages:
12
DOI:
10.1016/j.actamat.2011.03.028
File:
PDF, 2.51 MB
english, 2011