![](/img/cover-not-exists.png)
[IEEE 2013 IEEE International Symposium on Electromagnetic Compatibility - EMC 2013 - Denver, CO, USA (2013.08.5-2013.08.9)] 2013 IEEE International Symposium on Electromagnetic Compatibility - A framework for the simulation of electrostatic discharge immunity using the unified circuit modeling technique
Sekine, Tadatoshi, Asai, HidekiYear:
2013
Language:
english
DOI:
10.1109/isemc.2013.6670532
File:
PDF, 799 KB
english, 2013