[IEEE Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) - Singapore (8-10 Dec. 2004)] Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) - Design analysis of touch chip for enhanced package and board level reliability
Tong Yan Tee,, Hun Shen Ng,, Siegel, H., Bond, R., Zhaowei Zhong,Year:
2004
Language:
english
DOI:
10.1109/eptc.2004.1396706
File:
PDF, 342 KB
english, 2004