Design in triangle-profiles and T-profiles of a wirebond...

IEEE Transactions on Components and Packaging Technologies 2001 / Sept. Vol. 24; Iss. 3

Design in triangle-profiles and T-profiles of a wirebond using a linkage-spring model

Yu-Lung Lo,, Tei-Chen Chen,, Tieh-Lou Ho,
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Volume:
24
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/6144.946494
Date:
January, 2001
File:
PDF, 208 KB
english, 2001
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