Full RLGC model extraction of Through Silicon Via (TSV)...

Journal of Electromagnetic Waves 2014 / 09 Vol. 28; Iss. 13

Full RLGC model extraction of Through Silicon Via (TSV) with charge distribution effects

Luo, Guang-Xiao, Wei, Xing-Chang, Hao, Ran, Cui, Xiang, Li, Er-Ping
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
28
Language:
english
Journal:
Journal of Electromagnetic Waves and Applications
DOI:
10.1080/09205071.2014.933086
Date:
September, 2014
File:
PDF, 528 KB
english, 2014
Conversion to is in progress
Conversion to is failed