Thermal Management of a Stacked-Die Package in a Handheld Electronic Device Using Passive Solutions
Sung-Won Moon,, Prstic, S., Chia-Pin Chiu,Volume:
31
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2008.916858
Date:
March, 2008
File:
PDF, 850 KB
english, 2008