Mechanical and electrical evaluation of a bumped-substrate...

IEEE Transactions on Components Packaging and Manufacturing Technology Part B 1995 / 5 Vol. 18; Iss. 2

Mechanical and electrical evaluation of a bumped-substrate die-level burn-in carrier

Thompson, P., Begay, M., Lindsey, S.E., Vanoverloop, D.R., Vasquez, B., Walker, S., Williams, B.
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Volume:
18
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.386259
Date:
May, 1995
File:
PDF, 549 KB
english, 1995
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