Analysis of transient behavior of vertical interconnects in...

IEEE Transactions on Components Packaging and Manufacturing Technology Part B 1995 / Aug. Vol. 18; Iss. 3

Analysis of transient behavior of vertical interconnects in stacked circuit board layers using quasi-static techniques

Guang-Wen Pan,, Xiaojun Zhu,, Gilbert, B.K.
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Volume:
18
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.404111
Date:
January, 1995
File:
PDF, 1.03 MB
english, 1995
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