On enhancing eutectic solder joint reliability using a...

IEEE Transactions on Advanced Packaging 2000 / Feb. Vol. 23; Iss. 1

On enhancing eutectic solder joint reliability using a second-reflow-process approach

Kuo-Ning Chiang,, Yung-Te Lin,, Hsien-Chie Cheng,
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Volume:
23
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/6040.826755
Date:
January, 2000
File:
PDF, 398 KB
english, 2000
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