Intermetallic Layer Growth Kinetics in Sn-Ag-Cu System...

Advanced Engineering Materials 2015 / 04 Vol. 17; Iss. 4

Intermetallic Layer Growth Kinetics in Sn-Ag-Cu System using Diffusion Multiple and Reflow Techniques

Pawełkiewicz, Magdalena, Danielewski, Marek, Janczak-Rusch, Jolanta
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Volume:
17
Language:
english
Journal:
Advanced Engineering Materials
DOI:
10.1002/adem.201400226
Date:
April, 2015
File:
PDF, 2.71 MB
english, 2015
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