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[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Board level validation for green IC packaging with strain-controllable dynamic bending method
Jeffrey ChangBing Lee,, Chi-Ko Yu,, Graver Chang,, Tina Shao,, Cherie Chen,, Xiang-Kai.Meng,, Brown, MattYear:
2010
Language:
english
DOI:
10.1109/icept.2010.5582354
File:
PDF, 1.29 MB
english, 2010