Electromigration in Sn–Ag solder thin films under high...

Thin Solid Films 2014 / 08 Vol. 565

Electromigration in Sn–Ag solder thin films under high current density

Zhu, X., Kotadia, H., Xu, S., Lu, H., Mannan, S.H., Bailey, C., Chan, Y.C.
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Volume:
565
Language:
english
Journal:
Thin Solid Films
DOI:
10.1016/j.tsf.2014.06.030
Date:
August, 2014
File:
PDF, 2.20 MB
english, 2014
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