[IEEE IEEE 1998 International Interconnect Technology Conference - San Francisco, CA, USA (1-3 June 1998)] Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102) - Control of dielectric chemical mechanical polishing (CMP) using an interferometry based endpoint sensor
Fang, S.J., Barda, A., Janecko, T., Little, W., Outley, D., Hempel, G., Joshi, S., Morrison, B., Shinn, G.B., Birang, M.Year:
1998
Language:
english
DOI:
10.1109/iitc.1998.704756
File:
PDF, 353 KB
english, 1998