Rework techniques process evaluation for chip scale...

IEEE Transactions on Electronics Packaging Manufacturing 2000 / 07 Vol. 23; Iss. 3

Rework techniques process evaluation for chip scale packages

Nguty, T.A., Philpott, J.D., Ekere, N.N., Teckle, S., Salam, B., Rajkumar, D.
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Volume:
23
Language:
english
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/6104.873248
Date:
July, 2000
File:
PDF, 958 KB
english, 2000
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