Novel Method for Simultaneous Formation of Wires and Vias...

IEEE Transactions on Advanced Packaging 2006 / 05 Vol. 29; Iss. 2

Novel Method for Simultaneous Formation of Wires and Vias of a Printed Circuit Board Using Nanoporous Body

Asakawa, K., Matake, S., Hotta, Y., Hiraoka, T.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
29
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2006.871186
Date:
May, 2006
File:
PDF, 845 KB
english, 2006
Conversion to is in progress
Conversion to is failed