Thermal cycling lifetime of flip chip on board circuits...

Thermal cycling lifetime of flip chip on board circuits with solder bumps and isotropically conductive adhesive joints

Liu, J., Lai, Z., Nysaether, J.B.
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Volume:
23
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/6040.883767
Date:
January, 2000
File:
PDF, 177 KB
english, 2000
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