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Thermal cycling lifetime of flip chip on board circuits with solder bumps and isotropically conductive adhesive joints
Liu, J., Lai, Z., Nysaether, J.B.Volume:
23
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/6040.883767
Date:
January, 2000
File:
PDF, 177 KB
english, 2000