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[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - Image Inspecting System of Positioning Accuracy of the Die Bonder
Huang, Xiangxiu, Li, Ketian, Liu, Ji'an, Liu, Jian-qi, Weng, Ji-zhaoYear:
2007
Language:
english
DOI:
10.1109/icept.2007.4441540
File:
PDF, 1.48 MB
english, 2007